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Burn In Socket
Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.
Specifications
| DC BI Socket | Normal BI Socket | High Speed BI Socket | |
| Package Type | BGA, LGA etc. | BGA, LGA, QFN etc. | BGA etc. |
| Available Pitch | 0.3P~ | 0.3P~ | 0.8P~ |
| Characteristics | - Lifespan varies by test condition - No Ball Damage | - Lifespan varies by test condition - No Ball Damage | - Lifespan varies by test condition - No Ball Damage - Easy To Repair Board - Hi Speed Test |
