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Probe Head

Provides optimized wafer probing solution through the combination of high technology POGO probe and ultraprecision processing plate. High-performance MEMS probe head, applied with MEMS process, is capable of customized solution response by customer through low force, high CCC, and outstanding contact characteristics of high-strength material.


POGO Probe Head
MEMS Probe Head
Package Type
Wafer (WLCSP)
Wafer (SOC)
Available Pitch
- RF type, Signal length 2.0mm
- Solder Bump
- Wafer Probing & Single Die TEST
- High CCC > 1A
- Copper Pillar (Flat type)
- Wire Bond Pad (Point Type)
Product Series
Customized Solution for your needs

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Vietnam, and has partnerships with over 330 leading 
Domestic and national semiconductor companies in the world.

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