Home > Probe Head
Probe Head
Provides optimized wafer probing solution through the combination of high technology POGO probe and ultraprecision processing plate. High-performance MEMS probe head, applied with MEMS process, is capable of customized solution response by customer through low force, high CCC, and outstanding contact characteristics of high-strength material.

Specifications
POGO Probe Head | MEMS Probe Head | |
Package Type | Wafer (WLCSP) | Wafer (SOC) |
Available Pitch | 120um~ | 80um~ |
Characteristics | - RF type, Signal length 2.0mm - Solder Bump - Wafer Probing & Single Die TEST | - High CCC > 1A - Copper Pillar (Flat type) - Wire Bond Pad (Point Type) |