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Probe Head
Provides optimized wafer probing solution through the combination of high technology POGO probe and ultraprecision processing plate. High-performance MEMS probe head, applied with MEMS process, is capable of customized solution response by customer through low force, high CCC, and outstanding contact characteristics of high-strength material.
Specifications
| POGO Probe Head | MEMS Probe Head | |
| Package Type | Wafer (WLCSP) | Wafer (SOC) |
| Available Pitch | 120um~ | 80um~ |
| Characteristics | - RF type, Signal length 2.0mm - Solder Bump - Wafer Probing & Single Die TEST | - High CCC > 1A - Copper Pillar (Flat type) - Wire Bond Pad (Point Type) |
